Job Description
Job Description
Candidates must have 1 year of MFG Assembly Exp**
***Candidates on 2nd and 3rd must be able to train on 1st for 4-6 weeks***
Responsibilities involve the operation of microelectronics assembly equipment, including die and wafer processing, chip-and-wire assembly, assembly of various components, screening, visual inspection, measurement, and sorting of semiconductor devices.
Requirements:
- A high school diploma or GED is required
- Basic computer skills
- Excellent communication skills
- High attention to detail
Job Description:
- Operation of manual, automatic, and semi-automatic microelectronics assembly equipment with supervision
- Inspection of die and packages to various Military and Jedec standards using high and low power microscopes
- Follows defined specifications and reaction paths or written/verbal instruction
- Use multiple hand tools to manually process delicate products without damaging components
- Train other employees on basic equipment operation and assembly process
- Maintain well-organized and audit ready work areas
- Utilize computer-based manufacturing systems to move product and enter data